Business Areas
Design Competency
1) PCB Design
- Semiconductor Front-End / Back-End Test Board
(Probe Card, PIB, HIFIX, Load Board)
- CAMERA & CCTV Board(SONY, On-semi, Samsung…)
- FPGA Board for ASIC Development(Virtex6, Virtex7, Kintex…)
- Custom Controller Boards
Turnkey PCB Solution
Purchase Order
Specifications
Schematic &
Mechanical Drawing
Schematic &
Mechanical Drawing
Spec Review
Schematic check
Part Spec Review
Mechanical Review
Part Spec Review
Mechanical Review
Component
Library Check
Universal part
New part
Customer designated
New part
Customer designated
Mapping
Net Check
Library check
Library check
Customer Confirm
User Specification
Design Check
Open/Short
Customer special specifications
Mechanical Spec
Customer special specifications
Mechanical Spec
Artwork
Power Plane
Impedance Pattern
Normal Pattern
Impedance Pattern
Normal Pattern
Component Place
B/D Layout dxf check
Placement Review
Placement Review
CAM DATA extraction
Gerber
Stack-up
Location Data
Stack-up
Location Data
Manufacturing
PCB
SMT
SMT
Reliability Test
TDR, T/T, Propagation
Open/Short/Leakage
Open/Short/Leakage
(Customer Needs)
Simulation
↓
Simulation
↓
Purchase Order
Specifications
Schematic &
Mechanical Drawing
Schematic &
Mechanical Drawing
Spec Review
Schematic check
Part Spec Review
Mechanical Review
Part Spec Review
Mechanical Review
Component
Library Check
Universal part
New part
Customer designated
New part
Customer designated
Mapping
Net Check
Library check
Library check
Component Place
B/D Layout dxf check
Placement Review
Placement Review
Artwork
Power Plane
Impedance Pattern
Normal Pattern
Impedance Pattern
Normal Pattern
(Customer Needs)
Simulation
Design Check
Open/Short
Customer special specifications
Mechanical Spec
Customer special specifications
Mechanical Spec
Customer Confirm
User Specification
CAM DATA extraction
Gerber
Stack-up
Location Data
Stack-up
Location Data
Manufacturing
PCB
SMT
SMT
Reliability Test
TDR, T/T, Propagation
Open/Short/Leakage
Open/Short/Leakage
Design Portfolio
- Defence Industry(KAI), FPGA Board(26Layer, HPL)
- Main Chips :
MECURY DDR4(4N512M72T-16B2M),
Xilinx UltraScale(XQKU040-1RBA676M)
- Defence Industry(KAI), FPGA Board(26Layer, HPL)
- Main CHIP :
MECURY DDR4(4N512M72T-16B2M),
Xilinx UltraScale(XQKU040-1RBA676M)
- Defence Industry(KAI), FPGA Board(24Layer, HPL)
- Main CHIP :
MECURY DDR4(4N512M72T-16B2M),
Xilinx UltraScale(XQKU15P-1FFRE1517M)
- Defence Industry(KAI), FPGA Board(24Layer, HPL
)
- Main CHIP :
MECURY DDR4(4N512M72T-16B2M),
Xilinx UltraScale(XQKU15P-1FFRE1517M)
- Semiconductor Front-end Process Probe Card
- 46Layer, HPL
- Semiconductor Back-end Process HIFIX Board
- 44Layer, LP4X, HPL, BACK-DRILL
